- Forced Air Thermal Designs
- Liquid Cooled Thermal Designs
- Ambient Cooling Designs
- Conductive Cooling Designs
Thermal Design
Forced Air Thermal Designs
Heat pipe cooling assembly designed to accept forced air cooling from a fan unit that is integrated with system when installed. The left image shows the solid model design and the corresponding thermal analysis is shown on the right. Performance was confirmed with actual build.
Standard fin heat exchange designed to accept forced air cooling from the bottom of the unit and to enable a compact form. The image shows the thermal analysis of heatsink with dynamic forced air cooling from a fan mounted beneath it.
Liquid Cooled Thermal Designs
Compact liquid cooler thermal analysis showing also the flow and pressure drop across in/outlet of heat exchanger.
Low cost, compact & highly manufacturable liquid cooler thermal analysis showing the temperature distribution as well as the flow and pressure drop across in/outlet of heat exchanger.
Multisided cooling analysis were the application had three different heat sources that required cooling to maintain proper operation. The designed heat exchanger was shown to be able to seamlessly handle all three, as shown.
Ambient Cooling Designs
1.5 W, Ambient cooled MOSFET.
9 W, Ambient cooled high power shunt resistor.
5 W, Ambient cooled high power shunt resistor.
Space allocation limitations and complexity limits required a novel approach to adequate ambient cooling
Conductive Cooling Designs
Transient thermal analysis of a high power laser diode bar for extreme long pulse operation.
Tube heater dynamic flow thermal analysis were the objective was to heat up air entering the tube to 50 °C before the end of the length.
